Micropackaging support
MicroPackage Tape & Reel Service Offered by NPI Materials
Package Evolution... Shrinking
These packages are evolving and as a result, NPI Materials is routinely updating information in this table. A good example is a new IC introduced by Texas Instruments. The device pictured on the left is a common 0402 capacitor. On the right is the new DPL-2 package from TI. There is significant dimensional overlap with passive chips so this list does not display our complete package availability. Check the passive chips table as well.
| ID | Package | Type | W-P | Ao | Bo | Ko |
| 95 | BYZ-4 | WSP | 8X4 | 0.8 | 0.8 | 0.5 |
| 384 | YZP-6 | WSP | 8X4 | 0.9 | 1.4 | 0.5 |
| 39 | DPW | WSP | 8X2 | 1.0 | 1.0 | 0.6 |
| 81 | Dx | WSP | 8X2 | 1.0 | 1.1 | 0.6 |
| 116 | SOT1116 | WSP | 8X4 | 1.1 | 1.5 | 0.6 |
| 647 | YZP-8 | WSP | 8X4 | 1.1 | 2.1 | 0.7 |
| 96 | YFP-12 | WSP | 8X4 | 1.3 | 1.7 | 0.8 |
| 477 | DQN | WSP | 8X4 | 1.4 | 2.0 | 0.5 |
| 78 | CSP-1423 | CSP | 8X4 | 1.4 | 2.3 | 1.0 |
| 655 | QFN-1.3X2.0mm | QFN | 8X4 | 1.5 | 2.2 | 0.9 |
| 445 | QFN-1.6mm | QFN | 8X4 | 1.9 | 1.9 | 0.8 |