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Package Evolution... Shrinking

These packages are evolving and as a result, NPI Materials is routinely updating information in this table. A good example is a new IC introduced by Texas Instruments. The device pictured on the left is a common 0402 capacitor. On the right is the new DPL-2 package from TI. There is significant dimensional overlap with passive chips so this list does not display our complete package availability. Check the passive chips table as well.

ID	Package	Type	W-P	Ao	Bo	Ko
95	BYZ-4	WSP	8X4	0.8	0.8	0.5
384	YZP-6	WSP	8X4	0.9	1.4	0.5
39	DPW	WSP	8X2	1.0	1.0	0.6
81	Dx	WSP	8X2	1.0	1.1	0.6
116	SOT1116	WSP	8X4	1.1	1.5	0.6
647	YZP-8	WSP	8X4	1.1	2.1	0.7
96	YFP-12	WSP	8X4	1.3	1.7	0.8
477	DQN	WSP	8X4	1.4	2.0	0.5
78	CSP-1423	CSP	8X4	1.4	2.3	1.0
655	QFN-1.3X2.0mm	QFN	8X4	1.5	2.2	0.9
445	QFN-1.6mm	QFN	8X4	1.9	1.9	0.8